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1

Stacked solder bumping technology for improved solder joint reliability

Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A Dillard

Journal:

Microelectronics Reliability

Year:

2001

Language:

english

File:

PDF, 1013 KB

english, 2001

2

Effect of substrate flexibility on solder joint reliability

Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A Dillard

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 543 KB

english, 2002

3

Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area Chips

Lei, T.G., Calata, J.N., Guo-Quan Lu, Xu Chen, Shufang Luo

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2010

Language:

english

File:

PDF, 1.64 MB

english, 2010

4

The physiological responses of carnation cut flowers to exogenous nitric oxide

Chang-li Zeng, Li Liu, Guo-quan Xu

Journal:

Scientia Horticulturae

Year:

2011

Language:

english

File:

PDF, 308 KB

english, 2011

5

Thermo-Mechanical Reliability of Double-Sided IGBT Assembly Bonded by Sintered Nanosilver

Mei, Yun-Hui, Lian, Jiao-Yuan, Chen, Xu, Chen, Gang, Li, Xin, Lu, Guo-Quan

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.68 MB

english, 2014

6

Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates

Tan, Yansong, Li, Xin, Chen, Xu, Yang, Zhenwen, Lu, Guo-Quan

Journal:

Soldering & Surface Mount Technology

Year:

2019

File:

PDF, 2.01 MB

2019

7

[IEEE 2017 IEEE Energy Conversion Congress and Exposition (ECCE) - Cincinnati, OH (2017.10.1-2017.10.5)] 2017 IEEE Energy Conversion Congress and Exposition (ECCE) - Bonding of large substrates by silver sintering and characterization of the interface thermal resistance

Gao, Shan, Yang, Zhenwen, Tan, Yansong, Li, Xin, Chen, Xu, Sun, Zhan, Lu, Guo-Quan

Year:

2017

Language:

english

File:

PDF, 450 KB

english, 2017

8

Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability

Xu Chen, Y.C. Lin, Xingsheng Liu, Guo-Quan Lu

Journal:

Engineering Fracture Mechanics

Year:

2005

Language:

english

File:

PDF, 629 KB

english, 2005

9

Cytotoxic activity of the alkaloids from Broussonetia papyrifera fruits

Pang, Su-Qiu, Wang, Guo-Quan, Lin, Jun-sheng, Diao, Yong, Xu, Rui-an

Journal:

Pharmaceutical Biology

Year:

2014

Language:

english

File:

PDF, 577 KB

english, 2014

10

Pressure-Assisted Low-Temperature Sintering of Nanosilver Paste for 5$\,\times\,$5-${\rm mm}^{2}$ Chip Attachment

Gang Chen,, Yunjiao Cao,, Yunhui Mei,, Dan Han,, Guo-Quan Lu,, Xu Chen,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 1.96 MB

english, 2012

11

Nerve Growth Factor-β Expression Is Associated with Lymph Node Metastasis and Nerve Infiltration in Human Hilar Cholangiocarcinoma

Lei-bo Xu, Chao Liu, Guo-quan Gao, Xian-huan Yu, Rui Zhang, Jie Wang

Journal:

World Journal of Surgery

Year:

2010

Language:

english

File:

PDF, 401 KB

english, 2010

12

Effects of thermal aging on long-term reliability and failure modes of nano-silver sintered lap-shear joint

Tan, Yansong, Li, Xin, Chen, Gang, Gao, Qitong, Lu, Guo-Quan, Chen, Xu

Journal:

International Journal of Adhesion and Adhesives

Year:

2019

Language:

english

File:

PDF, 4.78 MB

english, 2019

13

Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode

Yan, Yi, Guan, Youliang, Chen, Xu, Lu, Guo-Quan

Journal:

Journal of Electronic Packaging

Year:

2013

Language:

english

File:

PDF, 1.76 MB

english, 2013

14

[IEEE 2011 2nd International Conference on Artificial Intelligence, Management Science and Electronic Commerce (AIMSEC) - Deng Feng, China (2011.08.8-2011.08.10)] 2011 2nd International Conference on Artificial Intelligence, Management Science and Electronic Commerce (AIMSEC) - The comparison and introducing of intellectual property protective measures in the management of internationally renowned universities' foreign-related scientific research

Jin-chao Yi,, Guo-quan Xu,

Year:

2011

Language:

english

File:

PDF, 283 KB

english, 2011

15

Investigation of Post-Etch Copper Residue on Direct Bonded Copper (DBC) Substrates

Yunhui Mei, Guo-Quan Lu, Xu Chen, Chen Gang, Shufang Luo, Dimeji Ibitayo

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 1.44 MB

english, 2011

16

Effect of Oxygen Partial Pressure on Silver Migration of Low-Temperature Sintered Nanosilver Die-Attach Material

Mei, Yunhui, Lu, Guo-Quan, Chen, Xu, Luo, Shufang, Ibitayo, Dimeji

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2011

Language:

english

File:

PDF, 385 KB

english, 2011

17

Rapid Sintering Nanosilver Joint by Pulse Current for Power Electronics Packaging

Mei, Yunhui, Cao, Yunjiao, Chen, Gang, Li, Xin, Lu, Guo-Quan, Chen, Xu

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2013

Language:

english

File:

PDF, 940 KB

english, 2013

18

Shrinkage and Sintering Behavior of a Low-Temperature Sinterable Nanosilver Die-Attach Paste

Tao Wang, Meihua Zhao, Xu Chen, Guo-Quan Lu, Khai Ngo, Shufang Luo

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 1.46 MB

english, 2012

19

Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging

Chen, Gang, Zhang, Ze-Sheng, Mei, Yun-Hui, Li, Xin, Lu, Guo-Quan, Chen, Xu

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1009 KB

english, 2013

20

Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

Tao Wang, Xu Chen, Guo-Quan Lu, Guang-Yin Lei

Journal:

Journal of Electronic Materials

Year:

2007

Language:

english

File:

PDF, 426 KB

english, 2007

21

High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force

Li, Xin, Chen, Gang, Chen, Xu, Lu, Guo-Quan, Wang, Lei, Mei, Yun-Hui

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.64 MB

english, 2013

22

Mechanism of Migration of Sintered Nanosilver at High Temperatures in Dry Air for Electronic Packaging

Lu, Guo-Quan, Yang, Wen, Mei, Yun-Hui, Li, Xin, Chen, Gang, Chen, Xu

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.41 MB

english, 2014

23

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Migration of sintered nanosilver die-attach material on alumina substrate at high temperatures

Mei, Yunhui, Ibitayo, Dimeji, Chen, Xu, Luo, Susan, Lu, Guo-Quan

Year:

2011

Language:

english

File:

PDF, 2.23 MB

english, 2011

24

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

Li, Xin, Chen, Xu, Lu, Guo-Quan

Journal:

Journal of Electronic Packaging

Year:

2010

Language:

english

File:

PDF, 678 KB

english, 2010

25

Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste

Yan, Yi, Chen, Xu, Liu, Xingsheng, Mei, Yunhui, Lu, Guo-Quan

Journal:

Journal of Electronic Packaging

Year:

2012

Language:

english

File:

PDF, 1.96 MB

english, 2012

26

Low-Pressure-Assisted Large-Area (>800 mm 2 ) Sintered-Silver Bonding for High-Power Electronic Packaging

Tan, Yan-Song, Li, Xin, Chen, Xu, Lu, Guo-Quan, Mei, Yun-Hui

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 2.78 MB

english, 2018

27

Tensile Behaviors and Ratcheting Effects of Partially Sintered Chip-Attachment Films of a Nanoscale Silver Paste

Xu Chen, Rong Li, Kun Qi, Guo-Quan Lu

Journal:

Journal of Electronic Materials

Year:

2008

Language:

english

File:

PDF, 348 KB

english, 2008

28

Transient Thermal Performance of IGBT Power Modules Attached by Low-Temperature Sintered Nanosilver

Gang Chen, Dan Han, Yun-Hui Mei, Xiao Cao, Tao Wang, Xu Chen, Guo-Quan Lu

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2012

Language:

english

File:

PDF, 1019 KB

english, 2012

29

Migration of Sintered Nanosilver Die-Attach Material on Alumina Substrate Between 250 and 400 in Dry Air

Yunhui Mei, Guo-Quan Lu, Xu Chen, Shufang Luo, Ibitayo, D.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2011

Language:

english

File:

PDF, 794 KB

english, 2011

30

Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging

Fu, Shancan, Mei, Yunhui, Lu, Guo-Quan, Li, Xin, Chen, Gang, Chen, Xu

Journal:

Materials Letters

Year:

2014

Language:

english

File:

PDF, 1.28 MB

english, 2014

31

Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

Dun-ji Yu, Xu Chen, Gang Chen, Guo-quan Lu, Zheng-qiang Wang

Journal:

Materials & Design

Year:

2009

Language:

english

File:

PDF, 1.05 MB

english, 2009

32

Characterization and Reliability of Sintered Nanosilver Joints by a Rapid Current-Assisted Method for Power Electronics Packaging

Mei, Yun-Hui, Cao, Yunjiao, Chen, Gang, Li, Xin, Lu, Guo-Quan, Chen, Xu

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.02 MB

english, 2014

33

Electrokinetic removal of Cu and Zn in anaerobic digestate: Interrelation between metal speciation and electrokinetic treatments

Zhu, Neng-min, Chen, Mengjun, Guo, Xu-jing, Hu, Guo-quan, Yu-Deng,

Journal:

Journal of Hazardous Materials

Year:

2015

Language:

english

File:

PDF, 324 KB

english, 2015

34

Batch-to-batch uniformity of bacterial community succession and flavor formation in the fermentation of Zhenjiang aromatic vinegar

Wang, Zong-Min, Lu, Zhen-Ming, Yu, Yong-Jian, Li, Guo-Quan, Shi, Jin-Song, Xu, Zheng-Hong

Journal:

Food Microbiology

Year:

2015

Language:

english

File:

PDF, 1.72 MB

english, 2015

35

Selective inhibition of CDK7 ameliorates experimental arthritis in mice

Xia, Yong, Lin, Li-Ying, Liu, Mei-Ling, Wang, Zheng, Hong, Hong-Hai, Guo, Xu-Guang, Gao, Guo-Quan

Journal:

Clinical and Experimental Medicine

Year:

2015

Language:

english

File:

PDF, 1.42 MB

english, 2015

36

Up-regulation of fatty acid oxidation in the ligament as a contributing factor of ankylosing spondylitis: A comparative proteomic study

Xu, Wei-Dong, Yang, Xin-Yu, Li, Da-He, Zheng, Kai-Di, Qiu, Peng-Cheng, Zhang, Wei, Li, Chun-Yang, Lei, Kang-Fu, Yan, Guo-Quan, Jin, Sheng-Wei, Wang, Jian-Guang

Journal:

Journal of Proteomics

Year:

2015

Language:

english

File:

PDF, 5.28 MB

english, 2015

37

Study on the interaction of intense femtosecond laser pulses with nanometre-sized hydrogen clusters

Li, Zheng, Cheng, Wang, Shao-Hui, Li, Bing-Chen, Liu, Guo-Quan, Ni, Ru-Xin, Li, Zhi-Zhan, Xu

Journal:

Chinese Physics

Year:

2006

Language:

english

File:

PDF, 524 KB

english, 2006

38

Two Types of Mass Abundance Distributions for Anionic Carbon Clusters Investigated by Laser Vaporization and Pulsed Molecular Beam Techniques

Zhai, Hua-Jin, Liu, Bing-Chen, Zhou, Ru-Fang, Ni, Guo-Quan, Xu, Zhi-Zhan

Journal:

Chinese Physics Letters

Year:

2000

Language:

english

File:

PDF, 339 KB

english, 2000

39

Enhanced Ionization of Linear Polyatomic Molecular Ions in Ultrashort Laser Fields

Lei, An-le, Ni, Guo-quan, Li, Zhong, Zhai, Hua-jin, Xu, Zhi-zhan

Journal:

Chinese Physics Letters

Year:

1999

Language:

english

File:

PDF, 268 KB

english, 1999

40

Transient Thermal Impedance Measurements on Low-Temperature-Sintered Nanoscale Silver Joints

Yunhui Mei, Tao Wang, Xiao Cao, Gang Chen, Guo-Quan Lu, Xu Chen

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 636 KB

english, 2012

41

Measurement of Photorefractive Two-Wave Coupling Exponential Gain Coefficient of LiNbO 3 :Fe Crystal

Sun, Qian, Li, Yu-dong, Xu, Jing-jun, Zhang, Xin-zheng, Zhang, Guo-quan, Liu, Si-min, Zhang, Guang-yin

Journal:

Chinese Physics Letters

Year:

1998

Language:

english

File:

PDF, 287 KB

english, 1998

42

Correlation between interfacial microstructure and bonding strength of sintered nanosilver on ENIG and electroplated Ni/Au direct-bond-copper (DBC) substrates

Xu, Qianye, Mei, Yunhui, Li, Xin, Lu, Guo-Quan

Journal:

Journal of Alloys and Compounds

Year:

2016

Language:

english

File:

PDF, 2.42 MB

english, 2016

43

Dual Inhibition of Plasminogen Kringle 5 on Angiogenesis and Chemotaxis Suppresses Tumor Metastasis by Targeting HIF-1α Pathway

Cai, Wei-Bin, Zhang, Yang, Cheng, Rui, Wang, Zheng, Fang, Shu-Huan, Xu, Zu-Min, Yang, Xia, Yang, Zhong-Han, Ma, Jian-Xing, Shao, Chun-Kui, Gao, Guo-Quan, Jain, Anjali

Journal:

Year:

2012

Language:

english

File:

PDF, 1.12 MB

english, 2012

44

Effects of mechanical alloying process and sintering methods on the microstructure and thermoelectric properties of bulk Bi0.5Sb1.5Te3 alloy

Li, Huayi, Jing, Hongyang, Han, Yongdian, Lu, Guo-Quan, Xu, Lianyong

Journal:

Year:

2013

Language:

english

File:

PDF, 3.47 MB

english, 2013

45

Reliability comparison between SAC305 joint and sintered nanosilver joint at high temperatures for power electronic packaging

Chen, Gang, Yu, Lin, Mei, Yun-Hui, Li, Xin, Chen, Xu, Lu, Guo-Quan

Journal:

Journal of Materials Processing Technology

Year:

2014

Language:

english

File:

PDF, 2.64 MB

english, 2014

46

Elucidating and Regulating the Acetoin-producing Role of Microbial Functional Group in Multispecies Acetic Acid Fermentation

Lu, Zhen-Ming, Liu, Na, Wang, Li-Juan, Wu, Lin-Huan, Gong, Jin-Song, Yu, Yong-Jian, Li, Guo-Quan, Shi, Jin-Song, Xu, Zheng-Hong

Journal:

Applied and Environmental Microbiology

Year:

2016

Language:

english

File:

PDF, 1.08 MB

english, 2016

47

The materials data ecosystem: Materials data science and its role in data-driven materials discovery

Yin, Hai-Qing, Jiang, Xue, Liu, Guo-Quan, Elder, Sharon, Xu, Bin, Zheng, Qing-Jun, Qu, Xuan-Hui

Journal:

Chinese Physics B

Year:

2018

Language:

english

File:

PDF, 352 KB

english, 2018

48

[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - FEM analysis with cyclic visco-plasticity for solder bumped flip-chip packaging

Xu Chen,, Yongcheng Lin,, Xingsheng Liu,, Guo-Quan Lu,

Year:

2003

Language:

english

File:

PDF, 400 KB

english, 2003

49

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Isothermal low cycle fatigue behavior of nano-silver sintered single lap shear joint

Li, Xin, Chen, Xu, Lu, Guo-Quan

Year:

2012

Language:

english

File:

PDF, 1.21 MB

english, 2012

50

[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nano-silver Paste

Cao, Yunjiao, Chen, Gang, Mei, Yunhui, Li, Xin, Lu, Guo-Quan, Chen, Xu

Year:

2012

Language:

english

File:

PDF, 1.36 MB

english, 2012

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